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SS8061G
1A Low Dropout Regulator with Enable
FEATURES
Adjustable output from 1.2V to 4.8V Output voltage options 1.5V, 1.8V and 2.5V (externally adjustable using resistors) Over-current and over-temperature protection Dropout voltage of 400mV at 1A load Enable pin Quiescent current of 10A in shutdown SOT-89-5 Package
DESCRIPTION
The SS8061 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. An enable-pin further reduces power dissipation while in shut-down. The SS8061 provides excellent regulation over variations in line, load and temperature. The SS8061 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors.
APPLICATIONS
Battery-powered systems Motherboards Peripheral cards Network cards Set Top Boxes Medical Equipment Notebook Computers
ORDERING INFORMATION
SS8061-15GTETR SS8061-18GTETR SS8061-25GTETR 1.5V output, in SOT89-5 with Pb-free lead finish, shipped on tape and reel. 1.8V output, in SOT89-5 with Pb-free lead finish, shipped on tape and reel. 2.5V output, in SOT89-5 with Pb-free lead finish, shipped on tape and reel.
This device is only available with Pb-free lead finish (second-level interconnect).
PIN CONFIGURATION
TYPICAL APPLICATION CIRCUIT
R3 IENH
SS8061G
VEN VIN VO GND
SS8061G
VIN 5 VEN 4
VEN VIN VO R1 C1 22F C2 47F R2
ADJ
1 ADJ
2 GND
3 VO Volts R2 R2=12k is recommended VO = R3 should be connected for current IENH restriction as VEN > VIN+0.3V 1.2 (R1+R2)
SOT-89-5
1/21/2005 Rev.2.01
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SS8061G
ABSOLUTE MAXIMUM RATINGS
Input Voltage.....................................................7V VEN Voltage..............................................VIN+0.3V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.....................150C Storage Temperature Range........-65C TJ +150C Reflow Temperature (soldering, 10sec)............260C Thermal Resistance Junction to Ambient........177C/W Thermal Resistance Junction to Case..............52C/W ESD Rating (Human Body Model).......................2kV
OPERATING CONDITIONS
(note 1)
Input Voltage........................................2.2V ~5.5V Temperature Range......................-40C TA +85C
ELECTRICAL CHARACTERISTICS
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =10F, TA = TJ = 25C unless otherwise specified (Note 3) PARAMETER
Supply Voltage Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature VEN Voltage High VEN Voltage Low VEN Bias Current Low ADJ Reference Voltage ADJ Pin Threshold VD IQ
SYMBOL
VIN VO
CONDITION
VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 1A VIN=3.3V,VEN=VIN VIN=3.3V,VEN=0V fi=120Hz, 1VP-P, IO=100mA IO=1A
MIN
2.2 -2 ----------------1.6 ----1.188 ---
TYP
--VO 0.2 0.8 1.7 16 55 0.4 0.8 150 ------1.2 0.2
MAX
5.5 2 2 2 2.5 35 --0.6 ------0.4 20 1.212 ---
UNIT
V % % % mA A dB V A C V V A V V
VENH VENL IENL VREF
Output Active Output Disabled VEN=0.4V VIN=2.2V, VADJ=VOUT, IO=10mA
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax; total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / JA. If this dissipation is exceeded, the die temperature will rise above 150C and IC will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.
1/21/2005 Rev.2.01
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SS8061G
TYPICAL PERFORMANCE CHARACTERISTICS
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =10F, TA = TJ = 25C (VOUT=1.8V)
Line Transient Response
Load Transient Response
Short Circuit Current
60 50 Ripple Rejection (dB) 40 30 20 10 0
10 100
Ripple Rejection
IL=10mA IL=1A
IL=500mA
VIN=4V COUT=10F Vripple=224mV
1000
10000
100000
1000000
Frequency (Hz)
Overcurrent Protection Characteristics
Start-up
1/21/2005 Rev.2.01
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SS8061G
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Max. Power Dissipation vs. PCB Top Copper Area
Max. Dissipation Power (W)
Max. Power Dissipation vs. TAMB
1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0
Unit:in
2
1.8 1.6 Max. Dissipation Power (W) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 0
A=0.1 A=0.2 A=0.3 A=0.4 A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0
1
2 3 4 PCB Top Copper Area (in2)
5
25
35
45
55 TAMB
65 (C)
75
85
Quiescent Current vs. Temperature
2.00 1.95 Quiescent Current (mA) Dropout Voltage (mV) 1.90 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 -25 -15 -5 5 15 25 35 45 55 65 75 85 VIN=3.0V VIN=5.0V 700 600 500 400 300 200 100 0 0
Dropout Voltage vs. IL
T=85C T=25C
T=-25C
200
400
Temperature (C)
600 IL (mA)
800
1000
Output Voltage vs. Temperature
1.824 1.819 Output Voltage (V) VIN=5.0V
Output Voltage vs. VIN
1.825 1.82 Output Voltage (V) 1.815 1.81 1.805
T=-25C IL=10mA T=85C T=25C
1.814 1.809 1.804 1.799 1.794 1.789 1.784 -25 -15 -5
VIN=3.0V
1.8
5 15 25 35 45 55 65 75 85 Temperature (C)
2.5
3.5
4.5 5.5 VIN (V)
6.5
1/21/2005 Rev.2.01
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SS8061G
RECOMMENDED MINIMUM FOOTPRINT
SOT-89-5
1/21/2005 Rev.2.01
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SS8061G
PHYSICAL DIMENSIONS
SOT-89-5
A C D F L
E B
I H G J
K
SYMBOL
A B C D E F G H I J K L
DIMENSION IN MM MIN MAX
4.40 4.05 1.50 1.30 2.40 0.80 3.00 REF 1.50 REF 0.40 1.40 0.35 5 TYP 0.52 1.60 0.41 4.60 4.25 1.70 1.50 2.60 -----
DIMENSION IN INCH MIN MAX
0.173 0.159 0.059 0.051 0.094 0.031 0.118 REF 0.059 REF 0.016 0.055 0.014 5 TYP 0.020 0.063 0.016 0.181 0.167 0.067 0.059 0.102 -----
Taping Specification
PACKAGE
SOT-89-5
Feed Direction SOT-89-5 Package Orientation
Q'TY/REEL
1,000 ea
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
1/21/2005 Rev.2.01
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